Engineering and Computer Science students – Cornell Cup USA, presented by Intel wants you
WHAT: The Cornell Cup USA, presented by Intel is a college-level embedded design competition created to empower student teams.
DEADLINE: Applications to join the competition are due by Wednesday, October 17, 2012.
EVENT: The competition’s finals will take place at Walt Disney World, Lake Buena Vista, Fla., May 3-4, 2013.
FOR MORE: Complete details, including official rules, timeline and interest forms, are available here.
ITHACA, N.Y. – Cornell Cup USA presented by Intel wants you for its 2012-13 competition.
The Cornell Cup is a college-level embedded design competition created to empower student teams to become the inventors of the newest innovative applications of embedded technology.
The competition is an academic year-long experience culminating in a two-day summit event at Walt Disney World, where finalists attend talks, network with leading engineering company sponsors, and showcase their original innovative entries.
After an application round, selected finalists will be awarded funding and equipment to help them develop their entries. At the finals, the top three finalist entries will win grand prizes set at $10,000, $5,000, and $2,500. The competition is open to all undergraduate or master’s level students in engineering, science or computer science in any accredited U.S. university.
Based upon the highly successful Intel Cup China that attracts over 26,000 students annually, the Cornell Cup was designed to provide an exciting “expo” spirit that invites students’ imaginations to construct any design they can dream up and create as the next great embedded technology invention.
MEDIA: Please publish or post this information for your student audiences. For more information or interviews on this year’s Cornell Cup USA presented by Intel, contact John Carberry in Cornell’s Press Relations Office at 607.255.5353 or firstname.lastname@example.org.